Advanced high-speed detection and measurement technology

Shadow free height detection and measurement technology

The ATHENA series is equipped with a 10Mp camera and multi angle projection for 100% 2D and 3D full inspection of PCBs.

Ensure complete shadow free optical detection and low false alarm rate, while maintaining high flexibility in system functionality.

The phase profile measurement technology has been used in the Pemtron solder paste detection system for more than 10 years, which is sufficient to prove the progressiveness and effectiveness of 3D technology

■ 8 4 Projection 3-layer 2D light source

2D and 3D synchronous detection algorithm

■ The telecentric lens provides high-precision detection

High configuration CPU and GPU to ensure image processing

■ Simple and clear user interface

Standard Component Library Management System

Offline real-time debugging system (option)

High speed detection technology

ATHENA uses advanced algorithms, powerful computing and image processors, and a 10MP 15um 180fps telephoto lens for high-speed and stable testing.

High component detection technology

ATHENA adopts a brand new 8-4 directional 3D projection technology, which can provide industry-leading all-round 3D detection of 27mm component height. The optional Z Axis can detect up to 60mm components.

Shadowless 3D technology

Circular light sources and multiple projection heads can completely eliminate the impact of high density and high components on PCB testing.

Optical font verification

Using the principle of color extraction and establishing sample comparison to identify the part name of components; Ability to add and modify OCR fonts to optimize the detection conditions of Part Name and better recognize fonts.

3D soldering height measurement

By utilizing our advanced 3D technology, ATHENA Series is able to detect areas that traditional 2D AOI cannot reach.

Added testing items for solder height, volume, and component coplanarity, greatly improving the ability to detect defective products.

3D Bow | Foot Detection

ATHENA Series detection principle: It can detect the solder height and volume of the lead pins, and provide high-quality, true color 3D images.

2D RGB algorithm

By using RGB color differentiation, operators can easily distinguish defects such as solder joints and bent feet.

Shadowless 3D technology

Circular light sources and multiple projection heads can completely eliminate the impact of high density and high components on PCB testing.

Optical font verification

The principle of using color extraction and establishing template comparison to identify component Part Names can increase and modify OCR fonts to optimize the detection conditions of Part Names and better recognize fonts.

3D soldering height measurement

By utilizing our advanced 3D technology, ATHENA Series is able to detect areas that traditional 2D AOI cannot reach.

Added testing items for solder height, volume, and component coplanarity, greatly improving the ability to detect defective products.

3D Foot Detection

ATHENA Series detection principle: It can detect the solder height and volume of pins, and provide high-quality, true color 3D images.

2D RGB algorithm

By using RGB color differentiation, operators can easily distinguish defects such as solder joints and bent feet.

Check the data automation system

Technical Parameter