Excellent imaging quality allows for quick and flexible detection, measurement, and recording of hidden solder joints in BGA, μ BGA FipChip, CSP, CGA, and SMD devices.

High resolution 5.0MP BGA inspection system with USB 3.0 interface

Small size, sturdy 90 ° optical probe with integrated stereo lighting

Interchangeable 90 ° side view and 8-80x top view PCB board inspection lens

High brightness background light source equipped with U-shaped prism and fiber optic probe

Built in light touch mechanism bracket for probe protection

Built in rotatable BGA probe pivot bracket

Precision XY platform, fast feed micro driver and magnetic nail

Including INSPECTIS image capture, utility programs, and metrology software

Designed specifically for flexibility

The Inspection BGA video inspection system is equipped with a USB3.05 million pixel video microscope with the smallest optical probe built-in with a high-energy light source. The integrated fiber light brush light source is mounted on a compact and sturdy bracket with an XY mobile platform.

The Inspection BGA system can generate high-resolution images of extremely low gap areas under BGA, μ BGA, CSP, CGA, and FlipChip packages, with a spacing as low as 40 microns.

Search for microcracks, cold solder joints, whiskers, solder balls, scaling, excessive flux, and other welding issues

The variable focusing capability of optical devices allows users to use their flexible, electronically dimmable fiber brush as background illumination to image BGA solder bumps from the first row to up to 20 rows.

The unique soft touch mechanism design in the bracket allows the microprism in the optical probe tip to be placed on the surface of the inspection PCB to prevent damage.

The 180 degree rotating mechanism facilitates the alignment of the probe along three different sides of the BGA package.

The detection system has two system level foundations and ProX




Developed to improve productivity

Built in high-resolution optical components, high-power lighting system, and fast USB 3.0 camera

The interface can generate clear, high frame rate real-time video of the detection object.

Due to the interchangeable side and top view optical components of the Inspection BGA system, it provides a flexible and versatile inspection solution that can effectively utilize investment budgets.


INSPECTIS Data Export and Report Comparison Table


System configuration and attachments



specifications