In the microscopic world of electronic manufacturing, 3D-SPI is like a quality inspector with "sharp eyes", ensuring the first step of circuit board soldering quality - the solder paste coating process. How does it actually perform its "special skills"?Benchuang PEMTRON 3D-SPI

Its core relies on a sophisticated optical measurement system. When the circuit board to be tested enters the 3D-SPI working area, the high-precision light source built into the device is instantly activated, emitting multiple beams of specially modulated light. These light rays are projected onto the surface of the solder paste at a specific angle, like fine probes touching every "skin" of the solder paste.

The surface of solder paste, due to its undulations and varied shapes, carries rich information when light is reflected back. The ultra sensitive optical sensor equipped with 3D-SPI quickly and accurately captures these reflected lights. By using complex triangulation algorithms to convert optical signals into spatial coordinate information, a three-dimensional model of solder paste can be constructed. This is not an ordinary model, it is precise to the micrometer level and can clearly present key parameters such as thickness, area, shape, and flatness of solder paste.

For example, if the solder paste accumulates too high at the chip pad, the light reflection will be significantly different from normal coating. After the sensor receives the information and the system calculates it, the area will be highlighted with bright colors or marks in the generated 3D image, warning the operator that the solder paste status is abnormal. In this way, the factory does not need to rely on manual rough judgment based on experience, but adjusts the solder paste printing parameters in a timely manner based on the precise data provided by 3D-SPI, ensuring that each circuit board can enter the subsequent soldering process with almost perfect solder paste coating state, laying a solid foundation for the high-quality output of electronic products.