The heat transfer mechanism of vacuum reflow soldering is mainly achieved through thermal conduction and radiation.German SMT vacuum reflow soldering

Thermal conduction is one of its important ways of heat transfer. During the vacuum reflow soldering process, the heat generated by the heating element is conducted to the printed circuit board through contact（PCB）Substrate and component pins. For example, when using a heating plate for heating, the heating plate andPCBDirect contact at the bottom, heat is transferred from the heating plate toPCBEach part of it. For components with pluginsPCBThe pins also become an important pathway for heat conduction, as heat is conducted from the pins to the component body, causing the solder to reach the melting temperature. This heat conduction method ensures that heat can be evenly distributed throughout the entire welding area, providing stable temperature conditions for the melting and solidification of the solder.

Thermal radiation is also an indispensable heat transfer mechanism in vacuum reflow soldering. For example, an infrared heating device heats up by emitting infrared radiationPCBAnd components. Infrared radiation has strong penetration ability and can directly radiate toPCBOn the surface and components, allow them to absorb heat and heat up. Different components andPCBThe absorption capacity of materials for infrared radiation varies, which requires precise control of the intensity and wavelength of infrared radiation to achieve the best heating effect. In a vacuum environment, the transfer efficiency of thermal radiation is relatively high because there is no obstruction from air or interference from thermal convection, and heat can be transferred more directly to the welding site.

In summary, vacuum reflow soldering efficiently transfers heat to the welded components through the synergistic effect of thermal conduction and radiation, ensuring that the solder melts and solidifies at the appropriate temperature, thereby achieving high-quality welding results.