Improve welding qualityVacuum environment can avoid oxidation and nitriding, ensuring welding purity; The pressure difference inside and outside the solder joint is conducive to the overflow of bubbles from the solder joint, reducing the void rate, improving the reliability, bonding strength, and solder wetting performance of the solder joint; It can effectively reduce the porosity and oxidation of welding materials, making the welding quality more stable and consistent, which is very important for some high reliability and high-quality applications, such as aerospace and defense.

Precise control of welding parametersDuring the welding process, precise control of temperature, time, and pressure can achieve precise control of the welding position and depth, thereby ensuring the accuracy of welding.

Wide applicabilityCan be used to solder various types of electronic components, such as BGA, CSP and other array packaged devices, meeting the modern electronic product's demand for miniaturization and high integration.

Easy to operate and low maintenance costHigh degree of automation, operators only need to perform simple settings and monitoring to achieve efficient welding operations; Moreover, due to its simple structure, the maintenance cost is relatively low.