Product characteristics

PH (10g/L) neutral

Flash point without flash point

Boiling point 103 ℃

Partially soluble in water

VOC，@ 10%     82.2  g/L

Main processes

Cleaning methods include spraying and ultrasonic waves

Use concentration<25%

Temperature 49 ℃

Rinse with deionized water

Dry hot air

TENIC ® A3300 is a neutral water-based cleaning agent based on FAST technology, used to clean solder paste and other uncured adhesives on printed steel mesh. After verification, A3300 can be used for various steel mesh cleaning equipment.

○ Can be used at room temperature

○ Low concentration usage

○ Suitable for spray and ultrasonic equipment

Effectively remove solder paste and uncured glue from the steel mesh

○ Suitable for standard steel mesh cleaning equipment

Environmental, Health, and Safety Regulations

TENIC ® A3300 is a harmless, biodegradable water-based cleaning agent. Does not contain CFC or HAP.

For detailed information, please refer to the safety data sheet.

compatibility

TENIC ® A3300 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes.

If you need specific and more detailed compatibility information, please contact our sales representative.

Free cleaning experiment and process optimization

We will provide customers with free cleaning and experimental services at the customer's factory end or in the laboratories designated by Singapore and Chinese Mainland to ensure that you achieve your goals.

Improve product yield and reliability by identifying and adjusting important parameters of your cleaning process.

We promise to have professional knowledge and understanding of your process. We can simulate your cleaning process and tailor it to your actual situation.

The laboratory is equipped with various cleaning equipment and analyzers, including:

○ Batch cleaning equipment ○ Scanning electron microscope

○ Online cleaning equipment ○ Ion analyzer

○ Ultrasonic ○ FTIR spectrometer

○ High magnification microscope ○ Humidity chamber