目前，2D-AOI几乎已经普及到了所有行业电子产品的SMT检测工艺中，可解决95%以上的不良类型。但对于翘脚，浮高以及微细短路等2D-AOI覆盖不到的检测盲点始终是业界难题，使用3D高度检测技术导入SMT工艺实是行业巨大的突破，不仅极大地提升了检出率，也可以有效的降低误报率，真正实现无人化检测，诺信德科技可以为您提供3D-AOI解决方案，这种3D检测工艺的开发来自韩国。
Solder, Damaged part & component, Lifted lead, Height, Distance between chips, Shift Tilt, High/Low volume, Rotation, Bridge, Tombstone, Reverse, OCV, Missing, Wrong chip, Pattern
Provides high speed and accurate inspection
Realize renovative work efficiency
Provides the latest tools for product quality control
Easy to manage SMT line (Integrated management system)
Customized economical SMT line management
