onePreparation stage: Prepare the items to be weldedPCBClean the board and electronic components to remove surface dirt and oxides to ensure welding quality. At the same time, evenly apply the solder paste onPCBOn the solder pads of the board.German vacuum reflow soldering

twoComponent mounting: using automated equipment such as a surface mount machine to accurately place electronic componentsPCBAt the corresponding position of the board. When placing components, it is important to pay attention to their polarity and orientation to ensure that they align withPCBThe design on the board is consistent.

threeReflow soldering:PCBPlace the board in a vacuum reflow soldering furnace for heating and welding. During the heating process, the solder powder in the solder paste melts and diffuses to the component pins andPCBWelding points are formed between the copper foils on the board. At the same time, the volatilization of flux helps to enhance the reliability and durability of the solder joints. Vacuum reflow soldering furnaces typically have multiple temperature zones, and the temperature and time of each zone can be precisely controlled to ensure welding quality.

fourCooling and inspection: After completing the heating processPCBNatural cooling of the board or rapid cooling through a cooling zone. After the temperature drops to room temperature, the welded partsPCBVisually inspect the board or use relevant testing equipment to confirm whether the welding quality meets the requirements. Common detection methods include visual inspectionXRadiation testing and flying needle testing, etc. For unqualified welding points, repair or reprocessing is required.

fiveSubsequent processing and testing: for welded partsPCBPerform necessary follow-up processing and testing on the board, including cleaning, labeling, testing functionality and performance, etc. Testing can verify the effectiveness of the reflow soldering process, ensuring reliable soldering quality and meeting design requirements. Meanwhile, the test results can also provide improvement basis and experience summary for subsequent production.